We, Tradpost Technology, employ fully qualified EMS quality personnel, experienced engineers and knowledgeable project end coordinating team of staff to provide the best support and solution to
our customer’s defined specifications for manufacturing.
Our EMS technical capability has made us stand out for expertise in fine pitch QFP, QFN and
BGA Integrated Circuit Chips.
- Facility area: 70,000 sq.ft.
- Production capacity: 380,000 PCB Assemblies monthly large and small
- Number of employee: 250
- High speed Surface Mount lines, Reflow Oven system
- Through hole insertion lines, Wave Soldering system
- Automated Optical Inspection
- Full function test using customer supplied jig
- PC network test
- Fine pitch QFP, QFN chips
- BGA chips
- Chip component 0402, (0201 by request)
- Partial or Full Turnkey build with plastic or metal casing assembled,
procurement and supply of cable, loom, manual, gift box, anti-static bags
and shipping carton and other accessories.